Texas Instruments Unveils Solderless Robotics Kit in India

  • The reusable kit allows students to build an embedded system in 15 minutes or less
  • TI launched the TI-RSLK series last year to provide students hands-on, customizable options for learning embedded systems design
  • The latest addition completes all tasks and robotic challenges covered in the classic TI-RSLK Maze Edition kit

American semiconductor design & manufacturing company Texas Instruments (TI) on Tuesday launched a low-cost robotics kit and curriculum for university education in Bengaluru, India.

The newest addition to the TI Robotics System Learning Kit (TI-RSLK) family, the TI-RSLK MAX is simple to build, code and test.

Designed for the university classroom, the solderless assembly allows students to have their own fully functioning embedded system built in under 15 minutes, the company said in a press release.


Classrooms that may not have access to soldering equipment can benefit from the solderless, hands-on kit and curriculum that can be reused year after year.

IEEE President and CEO, Professor Jose Moura, unveiled the product in Bengaluru in the presence of Doug Phillips, Director of TI’s Global University Program.

“Students in today’s classrooms are going to solve our most pressing engineering challenges. With more and more future engineers coming out of India, it is important that students here have access to the latest learning platforms and advancements in technology,” said Phillips.

“With the TI-RSLK MAX, students can quickly understand system concepts as early as their first year through building their own embedded system. This will help create the base knowledge that will benefit students in learning more complex topics covered in the advanced curriculum,” he added.

Key Features

The new kit includes the industry-leading SimpleLink MSP432P401R microcontroller (MCU) LaunchPad Development Kit, easy-to-connect sensors, and a versatile chassis board that turns the robot into a mobile learning platform.

Through accompanying core and supplemental curriculum, students can learn how to integrate their hardware and software knowledge to build and test a system. For advanced learning, wireless communication and Internet of Things (IoT) capabilities can be added to the TI-RSLK MAX to remotely control the robot or even establish robot-to robot communication.

TI launched the TI-RSLK series last year to help universities across the globe keep students engaged from their first day of class until graduation with hands-on, customizable options for learning embedded systems design.

The TI-RSLK MAX completes all tasks and robotic challenges covered in the classic TI-RSLK Maze Edition kit, such as solving a maze, line following and avoiding obstacles. It also provides a user-friendly assembly of the various sub-systems, speeding up the building and testing of the robot.

“Experimentation is what makes an engineer and TI-RSLK MAX is an addition to an already existing robust module, which is expected to reach out to more than 8000 universities across the globe, out of which over 2000 engineering colleges are in India alone,” said Professor Jose Moura while addressing the gathering at the launch of the new kit in Bengaluru.


The new robotics kit will be available for purchase in late August and will include the SimpleLink MSP432P401R MCU LaunchPad Development Kit, as well as all additional components required for assembly. To expand kit functionality and learning paths, optional accessories will be available for purchase.