IEEE EPS certificates are only available to Society members and can be earned through the accumulation of 15 Professional Development Hours (PDHs).
IEEE Electronics Packaging Society (IEEE EPS), the leading international forum for scientists and engineers engaged in microsystems packaging and manufacturing, has introduced a new IEEE EPS certificate program in order to further the education of its members.
Through this program, EPS aims to give those members who are new to electronics packaging an opportunity for further packaging education, offer continuous education in electronics packaging to existing members, and also to offer students electronics packaging training if they are in a University program that does not include packaging education.
The new IEEE EPS certificate program is open to all EPS members but is especially targeted at young professionals and students.
“As we approach the 3rd decade of the 21st century, with rapidly changing electronics packaging technology now a value creator and product differentiator across the electronic industry, the EPS certificate will help distinguish the unique skills and knowledge of our members in this critical domain of science and technology,” said Avram Bar-Cohen, president, IEEE Electronics Packaging Society.
“The new certificate program will help ensure that IEEE EPS members are up to date on the latest technological advancements and the practical applications found within the electronics packaging space, while opening the door to continuous education through course studies and active participation within the society,” he added.
IEEE EPS certificates can be received by completing 15 Professional Development Hours (PDHs). Check out the criteria for earning PDHs here.
EPS Packaging Vision Competition
IEEE EPS has also issued a final call for submissions to its Packaging Vision Competition. This award recognizes the best “Vision of the Future of Electronics Packaging” abstract.
The competition is open to all attendees of IEEE Electronic Components and Technology Conference (ECTC) and The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm).
The awards will be presented at the IEEE Electronic Components and Technology Conference (ECTC) to be held from May 28-31, 2019 at The Cosmopolitan of Las Vegas, Las Vegas, Nevada.
Find details on how to participate, click here.