Engineers Develop Semiconductor Material for Thermal Management

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New semiconductor material named defect-free boron arsenide to draw and dissipate heat from electronic devices

To resolve the problem of thermal management, the researchers of the University of California gave rise to a new semiconductor material named defect-free boron arsenide. It is said that this material will improve performance and reduce energy demand in all kinds of electronics, from small devices to the advanced computer data centre equipment.

Can fit into current manufacturing processes

According to researchers, it has a potential to be integrated into current manufacturing processes because of its semiconductor properties. The material posses high thermal conductivity more than three-times faster at conducting heat than currently used materials, such as silicon carbide and copper. Hence, can replace current state-of-the-art semiconductor materials for computers processors and other electronics, or for light-based devices like LEDs.

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Computer processors have continued to shrink down to nanometer sizes and each smaller generation of chips help make computers faster, more powerful and able to do more work. But doing more work also means they’re generating more heat and managing heat in electronics has increasingly become one of the challenges in optimising performance.

Therefore, engineers have developed a solution to this challenge that is defect-free boron arsenide which can be more effective at drawing and dissipating waste heat. If CPUs did not get as hot in the first place, then they could work faster and less energy would be needed to keep them cool.

It is also believed that this approach will continue to push the scientific frontiers in many areas including energy, electronics, and photonics applications.

 

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